Product Introduction

6SE7041-3TL84-1JC0 trigger board 4. Switch output module: SM322; can provide 8-way switch output, relay output mode; divided into 4 groups, each two-way share a common terminal. 3 racks can be extended, IM360 is inserted in the third slot of the central rack, IM361 is inserted in the first slot of the extension rack, the IM361 of the first extension rack is connected to the IM360 of the central rack, and the IM361 of the remaining racks is connected to the IM361 of the previous rack in sequence. The maximum connection length between racks is 10 meters. The power supply of the extension rack can be connected to an external 24V power supply through IM361. Each extension rack can install up to 8 application templates. In this way, no matter whether the slave station is powered on first or the master station is powered on first, the system can operate normally: Add OB82, OB86, OB122 in S7-300; add OB82~OB87, OB122 in S7-400; 88: What working mode should be selected when CP342-5 is connected to the host computer software or operation panel? If you only use CP342-5 to connect to the host computer software or operation panel (OP), the communication uses the S7 protocol, then it is recommended that you select NoDP mode, and there is no need to call FC1 (DP_SEND) and FC2 (DP_RECV) function blocks, which are only used in PROFIBUSDP communication; 89: Why is the system always in STOP state after power-on even if the CP342-5 switch has been turned to Run? You should check whether the STEP7 program and configuration are correct (delete the program and only download the hardware configuration), check whether the 24V power line connected to CP342-5 is normal, whether the M terminal is short-circuited with the M terminal of the CPU, whether the communication cable is connected correctly (confirm that the communication cable is not internally short-circuited), and whether the CP firmware is correct. Figure 2-6 shows the structure of the reference potential grounding (implemented by the grounding slider).

Gate overvoltage and overcurrent protection

Traditional protection mode: The protection scheme prevents gate charge accumulation and gate-source voltage spikes from damaging the IGBT-some protection elements can be set between the G pole and the E pole. The role of the resistor RGE in the figure below is to discharge the gate accumulated charge (its resistance can be 5kΩ); the two reverse series Zener diodes V1 and V2 are to prevent the gate-source voltage spikes from damaging the IGBT. In these applications, IGBTs usually exist in the form of modules, which are semiconductor products formed by IGBTs and FWD (freewheeling chips) through a specific circuit bridge package. The advantage of using modules is that the IGBT is already packaged, which is very convenient to install, and there is a heat dissipation device on the shell, which dissipates heat quickly when working at high power. In addition, there is also the isolation design between the control circuit part and the driven IGBT, as well as the design of a drive pulse circuit suitable for the gate. However, even so, in the actual industrial environment, the above scheme still has a relatively high product failure rate - sometimes even 5%. Relevant experimental data and research show that this is closely related to transient surges, static electricity and high-frequency electronic interference, and the response time and current resistance of the Zener tube are far from sufficient, which leads to overheating and damage of the IGBT.

Storage module 6DD1610-0AG1

Operation panel 6SE7090-0XX84-2FB0-2FBO

Power unit 6SL3352-1AE32-1AA1

Power unit 6SL3352-1AE32-1AA1

Display panel 6SL3055-0AA00-4BA0

6SL3353-3AE32-1AA0 power data board

SKKT213/16E thyristor module

6SY7000-0AD07 inverter capacitor bank

6RY1703-1HD01

power board C98043-A7020-L4

6SE7022-6TC84-1HF3 power board

6SE7033-8EE85-0AA0 rectifier feedback unit

6SL3040-0MA00-0AA1 inverter

6SL3053-0AA00-3AA0 monitoring module

A5E00123738 Original fan blower

A5E00453508 fiber board

Brand new original 6SE7041-8HK85-1HA0

Rectifier unit trigger board C98043-A1685-L43

6SE7038-6GL84-1JA1 power board

Siemens output module 6SE7041-3TL84-1JC0 trigger board 6SE7041-3TL84-1JC0 trigger board centralized module application Among them, OB1, OB35, and OB100 are the three commonly used basic organization blocks. This can be done in HWConfig: In the properties dialog box of the DP interface, the options "Commissioning/Testoperation" or "Programming, status/modify..." must be activated. For example, the digital input used by the process function cannot be used as a standard DI.

At present, in the process of using and designing IGBT, basically an extensive design mode is adopted-the required margin is large and the system is huge, but it is still unable to resist interference from the outside world and various failure problems caused by the system itself. Shunlei Electronics Company takes advantage of its production and design advantages in the semiconductor field, combines the characteristics of transient suppression diodes, and breaks through the design bottleneck by integrating the internal and external systems on the basis of studying the failure mechanism of IGBT. This article will break through the traditional protection method and explore the solution of IGBT system design.

In occasions with large output power, such as UPS power supply, EPS power supply in the industrial field, wind power generation, solar power generation in the new energy field, charging piles, electric control, and vehicle-mounted in the new energy vehicle field, IGBT can be seen everywhere.

IGBT failure occasions: from the inside of the system, such as stray electricity distributed in the power system, motor induced electromotive force, and load mutations will cause overvoltage and overcurrent; from the outside of the system, such as grid fluctuations, power line induction, surges, etc. In the final analysis, IGBT failure is mainly caused by overvoltage/overcurrent of the collector and emitter and overvoltage/overcurrent of the gate.

F4-150R12KS4

F4-150R12KS4

F4-100R12KS4

F4-100R06KL4

F3L300R07PE4

DZ800S17K3

DZ600N12K

DP15H1200T

DP10H1200T

DM2G400SH6N

DM2G400SH6A

DM2G300SH6N

DM2G300SH12A When using IGBT, we should first pay attention to the data and application manual provided by the original manufacturer. In the data manual, we should pay special attention to the important parameters of IGBT, such as static parameters, dynamic parameters, short parameters, and thermal performance parameters. These parameters will tell us the maximum value of IGBT, which is the maximum value that cannot be exceeded. After the design is completed, the parameters of IGBT also need to be guaranteed to be within a reasonable data range during operation.

DM2G200SH6N

DM2G150SH12A

DM2G100SH6N

DIM800NSM33-F076

DIM800NSM33-F011

DF300R12KE3

DDB6U84N16RR

DDB6U144N16RR

DDB6U144N16R

DDB6U134N16RR

DDB6U104N16RR Siemens output module 6SE7041-3TL84-1JC0 trigger board

6SE7041-3TL84-1JC0 trigger board The diagnostic buffer is a circular buffer with single diagnostic entries, which are displayed in the sequence of events; the first entry shows the most recent event. If the buffer is full, the oldest event will be overwritten by the new entry. Depending on the CPU, the size of the diagnostic buffer is either fixed or can be set through parameters in HWConfig. Sensors/actuators from explosion-proof zone 0 cannot be connected. However, sensors/actuators from explosion-proof zone 1 can be directly connected.

The guaranteed value of the gate-emitter drive voltage VGE of the IGBT is ± 20V. If a voltage exceeding the guaranteed value is applied between its gate and emitter, the IGBT may be damaged. Therefore, a gate voltage limiter circuit should be set in the IGBT drive circuit. In addition, if the gate and emitter of the IGBT are open, and a voltage is applied between its collector and emitter, as the collector potential changes, the gate potential increases due to the parasitic capacitance between the gate and the collector and emitter, and current flows between the collector and emitter. At this time, if the collector and emitter are in a high voltage state, the IGBT may heat up or even be damaged. If the gate circuit is disconnected during transportation or vibration of the equipment, and a voltage is applied to the main circuit without being noticed, the IGBT may be damaged. To prevent this from happening, a resistor of several tens of kΩ should be connected between the gate and emitter of the IGBT, and this resistor should be as close to the gate and emitter as possible.

In new energy vehicles, IGBT accounts for about half of the cost of the motor drive system, and the motor drive system accounts for 15-20% of the cost of the entire vehicle, which means that IGBT accounts for 7-10% of the cost of the entire vehicle, making it the second most expensive component after the MOSFET, and also determines the energy efficiency of the entire vehicle. As shown in Figure 2.

Since IGBT is a composite of power MOSFET and PNP bipolar transistor, especially its gate is MOS structure, in addition to the above protection, like other MOS structure devices, IGBT is also very sensitive to static voltage, so the following matters must be noted when assembling and welding IGBT:

- Before touching IGBT with your hands, you should discharge the static electricity on your body before operating, and try not to touch the drive terminal part of the module. If you must touch it, make sure that the static electricity on your body has been completely discharged;

- During welding, in order to prevent static electricity from damaging IGBT, the welding machine must be reliably grounded.

EndFragment-->A5E01283291 original

A5E01283282-001 driver board

6SE7041-2WL84-1JC0 trigger board

6SE7041-2WL84-1JC1 driver board

Resistor module A5E00281090

A5E00682888

A5E00194776

6SE7038-6GK84-1JC2 driver board

6SL3162-1AH00-0AA0

A5E01540278 cable connection line

A5E01540284 connection line

A5E00281090 resistor module

CUR board C9 8043-A1680-L1

Control board 6SE7090-0XX85-1DA0

6SL3040-1MA00-0AA0 Control unit

6SE7033-7EG84-1JF0 Driver board

6SE7035-1EJ84-1JC0 Driver board

6SE7090-0XX84-6AD5 Control board

6SY7000-0AC07

Hall sensor ES2000-9725

6SE7041-3TL84-1JC0 Trigger board 46: When measuring temperature (Fahrenheit) with S7-300 analog input modules, can the *error limits listed in the module description be used? On the central rack of the S7-300F, error-proof and non-error-proof (standard) digital E/A modules can be mixed. For this purpose, as in ET200M, an isolation module (MLFB: 6ES7195-7KF00-0XA0) is required to isolate the error-proof modules and standard modules in the central and expansion racks. PROFIBUS-DP is used to create large, extended subnets. These values must be transferred to the FM using FCCNT_CTRL by setting the corresponding trigger bit once on the FC. 61 Why is the SF light always on after startup when a 24V encoder is selected in FM350-1, and the FM350-1 does not work? To check, first select the encoder type (24V) in the software configuration, and then check the jumper switch on the side of the FM350-1, because the default switch is set to a 5V encoder, which is generally not set by the user. After startup, the SF light will be always on.

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